The MIC-713-OX is a compact, fanless AI system based on NVIDIA® Jetson Orin™ NX, designed for high-performance applications with a focus on reliability and scalability. Powered by NVIDIA’s Jetson Orin NX platform, it supports up to 100 TOPS (Tera Operations Per Second) and provides exceptional computational power for AI edge applications. It offers flexible connectivity options, including 2 x GbE ports, 6 x USB 3.2 Gen 2 ports, and expansion capabilities like mPCIe and M.2 slots. Additionally, the system supports Allxon 24/7 remote monitoring and OTA deployment, ensuring continuous performance management. With its robust design, this system operates in challenging environments, with an operating temperature range of -10°C to 60°C and high vibration and shock resistance.

 

Features

• Compact fanless design
• Embedded NVIDIA® Jetson Orin™ NX up to 100 TOPS
• Supports 2 x GbE, 6 x USB 3.2 Gen 2
• Supports 1 x mPCIe, 1 x M.2 3052, 1 x M.2 2280
• Supports Allxon 24/7 remote monitoring and OTA deployment

 

Specifications

Download MIC-713-OX specification (EN, .pdf)

Model	MIC-713-OX
Processor System
CPU	16GB: 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 8GB: 6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU
GPU	1024-core NVIDIA Ampere GPU with 32 Tensor Cores
Memory	16GB: 16GB LPDDR5 8GB: 8GB LPDDR5
Flash	-
I/O
Ethernet*	2 x 10/100/1000 Mbps
Display	HDMI (Max. resolution 3840x2160 @ 60Hz)
USB	External: 6 x USB 3.2 Gen 2
Digital I/O	4-ch DI, 4-ch DO
Serial Port (Optional)	2 x RS-232/422/485 (On-board pin header reserved)
CANBus	1
OTG USB	1 x Micro USB
Expansion
Mini PCIe	1 x mPCIe (Signal: PCIe + USB 2.0)
M.2	1 x M.2 3052 (Signal: USB)
SIM	2 x Nano SIM slots
TPM (Optional)	1 x TPM 2.0
GMSL (Optional)	2-ch GMSL2.0 with FAKRA connectors
Storage
M.2	1 x M.2 2280 (Signal: PCIe x1, Gen 4)
SD Card	1 x Micro SD
Power
Mode	AT
Input Voltage	9 ~ 36 VDC
Environment
Operating Temperature**	-10 ~ 60 °C with 0.7 m/s airflow
Operating Humidity	95% @ 40 °C (non-condensing)
Vibration	3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis
Shock	10G / 11ms
Mechanical
Dimensions (W x D x H)	194.8 x 174.3 x 65.85 mm
Weight	2.05 kg (w/o packing material)
Installation	Desktop
BSP
Jetpack	Above 5.1
Certifications
Certificate	CE/FCC/UKCA/CB/UL/BSMI/CCC (No RED certification)

* PoE function by request. ** Depending on the installation situation and interface connection. Derating of max. operating temp. is possible when using the cellular LTE module.